Compact
The conventional LED printheads had their limit in how high their resolution can go because as the resolutions become higher, the number of elements increases, and the installation density of the wire bond that electrically connects the LED array to the driver IC became higher.
The epitaxial thin film bonding technology that OKI Digital Imaging developed implements connection/wiring in a semiconductor process without using the high density wire bonding technology, enabling to make the devices smaller and the resolutions higher.
With this device adopted for the new LED printhead, the number of chips mounted on a PCB is reduced to one half and that of wires to one fifth of the conventional head, which enabled todrastically improve the printhead productivity.
As only one type of chips is required of mounting them on a PCB, which enables to achieve reducing the head volume in half. This contributes to making a printer smaller.
| Item | EFB v. conventional ratio |
|---|---|
| Mounted chips | 50% |
| Gold wires | 20% |
| Board width | 66% |
