●December 2, 2009: Received the 16th ”STS Award” at the Speech in ”Semi-con. Japan 2008” for ”Epi Film Bonding Technology”.
Press Release - Japanese
●December 4, 2007: Received ”Ministry of Economy, Trade, and Industry Award” from Japan Society for the Promotion of Machine Industry for bringing the Epi Film Bonding technology to practical use.
Press Release - Japanese
●August 7, 2007: Received Outstanding Performance Award in the Second Monozukuri Nippon Grandprix from the Ministry of Economy, Trade and Industry for bringing in to market the light source for printer optical writing adopting the EFB technology.
Press Release - Japanese
●March 29, 2007: Received Incentive Award in The fourth Parts Monozukuri Grandprix from Nikkan Kogyo Journal for the new type of LED printhead adopting the EFB technology.
●March 16, 2007: Received the Nikkei BP Technology Award 2007 for bringing into practical use of the EFB technology for bonding the different types of film onto Si Wafers at regular temperature.
Press Release - Japanese

 

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